Bga Stencil — Amaoe BGA Reballing Stencil Template For iPhon

Azabooti presents the Amaoe BGA Reballing Stencil Template for iPhone devices, delivering precise tin planting and soldering for delicate boards. This stainless steel kit supports accurate BGA placement with repeatable alignment.

Unlock precise BGA reballing for your iPhone with Amaoe's professional stencil kit. This high quality stainless steel reballing stencil delivers factory-like accuracy, helping you place solder balls with confidence and minimize rework on delicate boards.

Premium build – High-quality stainless steel stencil with square hole patterns for repeatable alignment and cleaner soldering results.
Wide compatibility – Designed to work across iPhone 6S to 17 series, including Pro and Pro Max variants.
Accurate tin plating – A dedicated tin planting / soldering net with precise hole geometry to support reliable solder joints.
Easy to use – Clear grid layout and alignment guides help you position BGA chips accurately even in tight workspaces.
Compact, ready-to-use kit – Includes a set of durable stencils ready for repetitive use, packaged for safe transport.

The Amaoe BGA Planting Stencil Kit is built for careful craftsmanship. BGA chips are tiny and fragile; accurate soldering requires clean boards, proper temperature control, and skilled handling. This stencil improves your alignment, reduces the risk of missing balls, and helps you achieve consistent results when reballing or tin plating new joints on iPhone logic boards.

How to use: prepare your PCB and stencil, clean surfaces thoroughly, align the stencil over the target pads, and apply solder via appropriate flux and tin. After tinning, inspect the joints for bridging and rework as needed. Remember to maintain steady heat and avoid overheating to protect sensitive components.

Care and maintenance: after use, clean the stencil with isopropyl alcohol and a soft brush. Store in its protective packaging to prevent bending or surface contamination. If you notice any misalignment or damaged holes, replace the stencil to maintain accuracy.

Specifications

Brand: NoEnName_Null
Material: Stainless steel / metal
Type: BGA reballing stencil
Application: Computer tool kit for BGA repair and tin planting
Package: Bag
Recommended use: for iPhone 6S through iPhone 17 series including Pro and Pro Max variants

Shipping and handling: items ship within 3 days of payment. Delivery times vary by location, with most regions experiencing a typical transit window of two to four weeks. For best results, pair this stencil with proper BGA rework station, flux, and compatible solder balls.

What you get: a durable BGA planting stencil set designed for repeated use, with multiple grid patterns to accommodate different ball counts and pad layouts. Each stencil is engineered to resist warping and maintain consistent thickness for reliable solder deposition during iPhone repairs.

Amaoe BGA Reballing Stencil Template For iPhone 17 16 15 14 13 12 11 Pro Max XSMax 8 7P 7 6 A18 Tin Planting Soldering Net tools

Features

Place solder balls accurately with guide grids
Support across iPhone 6s to 17 series
Stainless steel stencil for durability
Dedicated tin planting net for reliable joints
Compact kit ready for repeated use
Clear layout for tight workspaces
Factory-like accuracy with square hole patterns

Frequently Asked Questions

What devices does this stencil support?

The stencil is designed to work with iPhone models from 6s through 17 series, including Pro and Pro Max variants. It provides repeatable alignment to minimize rework on BGA boards.

How does the tin planting net improve solder joints?

The dedicated tin planting net offers precise hole geometry to guide solder ball placement. This helps achieve consistent joints and reduces the risk of bridging or misalignment during reballing.