Original NC-559-ASM 10cc Flux No Clean Flux for Soldering SMD BGA Reballing Soldering Welding Flux Solder Paste

Primary soldering flux for electronics, Azabooti offers no clean NC-559-ASM flux for precise pcb repair and smd rework. This 10cc flux paste supports BGA and CSP joints with minimal residues.

Original NC-559-ASM Flux No Clean Flux for Soldering delivers reliable, clean joints for PCB work, SMD, BGA reballing, and detailed repair tasks without leaving difficult residues. You’ll get high-visibility results with a wash-free formulation that minimizes pale yellow residue, helping you keep boards clean for quick rework and reliable testing.

Designed for precision, this 10cc flux paste is a high-viscosity, no-clean flux that supports soldering, rework, and BGA/CSP joint repair. Its resin-based base blends with alloyed powder to create strong, consistent wetting on sensors, connectors, and electronic components. Its low-residue characteristic reduces cleaning requirements, making it ideal for mobile devices and other delicate PCBs where time and cleanliness matter.

Key benefits you’ll appreciate include easier soldering of fine-pine components, smoother wetting for BGA and CSP joints, and a cleaner post-solder finish that simplifies inspection and rework. This NC-559-ASM formulation is optimized for minimal residue color, helping you achieve a bright, near-clean appearance after reflow or hand soldering. It’s suitable for repairs on computers, phones, and various electronic assemblies where maintaining surface integrity is essential.

What you’ll get is a compact 10ml (10cc) syringe-based flux designed for reliable paste application during SMT maintenance, BGA reballing, and general soldering tasks. The package includes two additional precision mixing tips and a separate plunger/needle for accurate application, enabling you to target specific joints without excess material.

Applications and compatibility cover a wide range of electronics work, including sensors, wires, motors, connectors, metal shells, lighting, and SMT repair. The paste is described as wash-free with a very light residue and a high SIR value, making it well-suited for BGA and CSP joint repair where thorough cleaning is impractical and time is critical.

Usage tips – apply a small amount of flux to the joint, place the component, and reflow with your preferred soldering method. After soldering, inspect the joints for consistent fillets and absence of cold solder joints. If required, you can perform a light cleaning only if needed, but the formulation is designed to minimize post-solder residues.

Product details – Volume: 10ml; Net weight: 9g per piece; Gross weight: 18g per piece; Container: ABS shell; RoHS-certified; Particle size: 1-10 micrometers. The product is described as wash-free with a light residue color and a high SIR value, suitable for delicate electronics work and reballing tasks.

Note: Color appearance may vary slightly due to monitor settings and lighting. Please allow minor measurement variations due to manual measurement.

Features

• Dries clean with low residue.
• Facilitates smooth wetting on fine-pine parts.
• Supports soldering and rework on SMD components.
• High-viscosity paste for controlled application.
• Resin-based base blends for reliable joints.
• Includes syringe and precision mixing tips.

Specifications

• Materials: flux paste, syringe, precision mixing tips, plunger and needle, resin based base flux, alloyed powder

Frequently Asked Questions

Is NC-559-ASM suitable for mobile device repair?

Yes, its low residue makes post-solder cleaning easier and ideal for delicate PCBs in mobile devices. It reduces cleaning time during rework.

What surfaces can this flux paste be used on?

The flux works on sensors, connectors, and various electronic components. It provides strong wetting on BGA and CSP joints while remaining clean.

Does this flux require special storage or handling?

Store in a cool, dry place away from heat sources. Use the included plunger, syringe, and tips for precise application to avoid contamination.